Optical chip-to-chip connection with polymer fibers
Optoelectronics is yet in mass production have not yet arrived at the chip level. Although fiber connections in telecommunications over long distances or even within data centers or buildings have been established; in modular computing systems sometimes optical interconnects are used. But at the chip level is still lacking appropriate, so affordable and suitable for mass production and assembly process.
Researchers at the Karlsruhe Institute of Technology (KIT) by Professor Christian Koos have developed a method to produce semiconductor chips directly to visually bind. Similar to electrical bonding wires her looks Photonic wire bonding, but instead of a metal wire is a polymer fiber used. It is exactly adapted to the required form, thus also be due to the optical waveguide in the chip, in a silicon-on-insulator (SOI) layer. On the surface of the chip is a polymer which KIT researchers work with a 3D laser lithography system from Nanoscribe. In experiments on the optical connection was more than five terabits of data per second.
A particular advantage of their procedure emphasize the KIT scientists that no more precise positioning of the two chips is necessary to each other. Rather, the light-conducting polymer structure become adapted to the position and the surface of the respective chips.
Subscribe to:
Post Comments (Atom)
No comments:
Post a Comment